Molding | Page 2 of 2 | Basff Thermal Engineering

High density E-glass felt.

100% polyimide fiberboard for thermal insulation at 288 °C.

Board made from glass fiber and polyesther resin with a ribbed surface.

Multi-layer board made from Duraglas S and Cogetherm M for presses insulation.

Glass mat board with polyester resin up to 200 °C.

Glass mat board with high temperature epoxy resin up to 220 °C.

Polyimide fiber panel with Cogemicanite sheets on both sides , 288 °C working temperature.

Muscovite mica and silicone resin board for thermal and electrical insulation at 500 °C.

Cement board for thermal insulation at 350 °C.

Application Sector:Molding